Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications

Nitrogen in IR Reflow Soldering

Numerical Modelling of Backfill Grouting Approaches in EPB Tunneling

One of the main issues involved during tunnel construction with tunnel boring machines is the tail gap grouting. This gap is between the external diameter of tunnel lining and the excavation boundary that is filled with high-pressure grouting materials. In this work, three different approaches of gap grouting modeling in the FLAC3D software are investigated with a special attention to the...

Reflow Soldering Guidelines for Surface - Mount Devices

the role of application of dynamic assessment approach in improvement of iranian efl writing performance at different language proficiency levels

the present study sought to investigate the role of dynamic assessment (da) in improvement of iranian efl writing performance at different language proficiency levels. to this end, after conducting the quick placement test, 60 iranian efl learners were assigned to two groups with different language proficiency levels. in both groups each participant wrote two compositions, one before and one af...

Modelling the self-alignment of passive chip components during reflow soldering

In my research a 3D model was created to investigate the restoring force arising and the self-alignment occurring during reflow soldering; and simulations were performed to examine the assumptions given by the model. Besides, experiments were carried out to verify both the assumptions and the simulation predictions. Passive components with the size of 0603 (1.5 x 0.75 mm) were placed with inten...